Causes of Aluminum Precision Electronics Micro Screws
2026,04,09
Stress includes thermal and mechanical stress, primarily caused by mechanical, chemical, operational shock, and heat. Specifically, it arises from the following factors:
2. During the production process, mold temperature continues to rise. When the mold temperature overheats, it is prone to sticking, causing moving parts to malfunction and resulting in surface damage to the Precision Electronics
Micro Screws.
3. Precision Electronics Micro Screws should be preheated to a certain temperature before production. Otherwise, when the hot molten metal fills the mold, it will cause a sudden chill, resulting in a large temperature gradient between the inner and outer layers of the Precision Electronics Micro Screws, forming thermal stress, which can cause surface cracking or even cracking.
4. Stress is generated during steel quenching. This is the result of the superposition of thermal stress during cooling and structural stress during phase transformation. Quenching stress is the cause of deformation and cracking, so tempering is necessary to eliminate this stress.
5. Improper heat treatment can cause cracking and premature failure of Precision Electronics Micro Screws. This is especially true when only quenching and tempering is used without quenching, followed by surface nitriding. Surface cracking and cracking can occur after thousands of die-cast cycles.
